On behalf of the Hong Kong Special Administrative Region Government (HKSAR Government), the Hong Kong Monetary Authority (HKMA) announced the results of the 3-year HKD institutional bond tender. The tender, which is part of the Infrastructure Bond Program, was held on October 23, 2024, according to the Hong Kong Monetary Authority.
Bond issuance details
The HKMA offered a total of HK$5.5 billion in three-year government bonds. The bond, identified with issue number 03GB2710001, attracted significant interest with a subscription amount of HK$21.375 billion. This demand resulted in a bid-to-cover ratio of 3.89, indicating high investor interest.
The average acceptable price for these bonds was 99.89, or an annualized yield of 2.952%. The lowest price allowed was 99.75 and the return was 3.000%. The average bid price was 99.30 and the rate of return was 3.160%.
Key dates and financial details
The bond with a coupon rate of 2.89% has an issuance and settlement date of October 24, 2024 and a maturity date of October 25, 2027. The stock code for this bond is 4283 (HKGB 2.89 2710).
A proportional ratio of approximately 99% was applied to ensure fair distribution among successful applicants. The significant interest in this bid reflects the Hong Kong government’s confidence in its financial instruments.
Context and Implications
This bond issuance forms part of the HKMA’s broader strategy to manage financial stability and liquidity in the region. Strong demand and favorable returns highlight investor confidence in Hong Kong’s economic prospects despite global financial uncertainty.
The successful bid is also consistent with the HKSAR government’s goal to support infrastructure projects through strategic bond issuance and provide a stable financial base for future development.
Image source: Shutterstock